+34 942 13 67 19


From initial concept, we are able to design, manufacture and assemble dust-speck sized micro parts to be manufactured in both small and large volumes.

Some of our strengths in this field include:

Excellent quality control and production scheduling systems to ensure efficiency in our manufacturing.

The versatility to customize all of our products to fit our customers’ needs.

A high degree of innovation.

AWGE Technologies offers a complete microelectronic assembly capability: Die attach, wire & ribbon bonding, SMT assembly, Connector assembly, etc. Following the most demanding defence and space standards: ECSS-Q-ST-70-08/ IPC J-STD-001/ MIL-STD-883.

For the performance of the micro-assembly the company counts on:

  • ESD Integration of active and passive devices.
  • Solder reflow station.
  • Semiautomatic Die/wedge bonder: Hybond model 626 (Ball, Wedge, Bump, Peg bonder and pick and place, Die bonding (Eutectic and Adhesive).
  • Clean Room Area:
    • Safety access system: ISO Class 8 (1:100.000).
    • Clean Room:
      • ISO Class 7 (1:10.000) General working area.
      • ISO Class 6 (1:1.000) Micro assembly Work area.

AWGE Technologies

Your reliable partner to develop innovative and competitive products and turn-key solutions.

Reach Us.

In a global world we are closer than ever. Let’s take advantage of it.

Avda. de los Castros. (CDTUC) Fase A. Oficina 209, 39005 Santander, Cantabria.

+34 942 136 719

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